256Mbyte DDR SDRAM 200SODIMM module featuring 266 MHz clock rate and 0.75 ns access time. This unbuffered small outline dual in-line memory module utilizes 32Mx64 organization with 8 chips per module, each configured as 32Mx8 TSOP. Operating at a typical 2.5V supply voltage, it offers a 64-bit data bus width and 2 CAS latency. The non-lead-frame SMT package measures 67.56mm (Max) length, 3.81mm (Max) width, and 31.75mm height, designed for socket mounting.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.56(Max) |
| Package Width (mm) | 3.81(Max) |
| Package Height (mm) | 31.75 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 256Mbyte |
| Module Type | 200SODIMM |
| Maximum Access Time | 0.75ns |
| Maximum Clock Rate | 266MHz |
| Chip Density | 256Mbit |
| Subcategory | DDR SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 8 |
| Organization | 32Mx64 |
| Chip Package Type | TSOP |
| Typical Operating Supply Voltage | 2.5V |
| Maximum Operating Current | 2800mA |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 32Mx8 |
| ECC Support | No |
| CAS Latency | 2 |
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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