2GB DDR2 SDRAM 240-pin UDIMM module, operating at 800 MHz with a 64-bit data bus width. Features dual ranks and a CAS latency of 6, organized as 128Mx64x2. Utilizes FBGA packaged chips with a 1G bit density, configured as 128Mx8. Operates from a 1.7V to 1.9V supply voltage, with a typical voltage of 1.8V, and functions within a 0°C to 85°C temperature range. The non-lead-frame SMT package is a 240-pin UDIMM, 133.5mm in length, 4mm wide, and 30mm high, with a 1mm pin pitch for socket mounting.
PackageUDIMM
MountingSocket
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Technical Specifications
Microchip W3HG2128M64EEU806D6GG technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
UDIMM
Package Description
Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5
Package Width (mm)
4(Max)
Package Height (mm)
30
Pin Pitch (mm)
1
Mounting
Socket
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
240UDIMM
Maximum Clock Rate
800MHz
Chip Density
1Gbit
Subcategory
DDR2 SDRAM
Data Bus Width
64bit
Number of Chip per Module
16
Organization
128Mx64x2
Chip Package Type
FBGA
Typical Operating Supply Voltage
1.8V
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
128Mx8
ECC Support
No
Number of Ranks
Dual
CAS Latency
6
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
4A994.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Microchip W3HG2128M64EEU806D6GG Datasheet
Download the complete datasheet for Microchip W3HG2128M64EEU806D6GG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.