512Mbyte DDR SDRAM DRAM Module, 200-pin USODIMM form factor, operating at 333 MHz with a 64-bit data bus width. Features dual ranks and a CAS latency of 2.5, utilizing TSOP packaged chips. Designed for socket mounting with a maximum package length of 67.75mm, width of 3.8mm, and height of 31.9mm. Operates within a voltage range of 2.3V to 2.7V and a temperature range of -40°C to 85°C.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 31.9(Max) |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 512Mbyte |
| Module Type | 200SODIMM |
| Maximum Access Time | 0.7ns |
| Maximum Clock Rate | 333MHz |
| Chip Density | 512Mbit |
| Subcategory | DDR SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 8 |
| Organization | 32Mx64x2 |
| Chip Package Type | TSOP |
| Typical Operating Supply Voltage | 2.5V |
| Maximum Operating Current | 3040mA |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 32Mx16 |
| ECC Support | No |
| Number of Ranks | Dual |
| CAS Latency | 2.5 |
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | 4A994.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
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