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Technical Specifications
Micron HB56U232SB-6C technical specifications.
General
| Pin Count | 72 |
| PCB | 72 |
| Package Length (mm) | 107.95 |
| Package Width (mm) | 9.14(Max) |
| Package Height (mm) | 25.4 |
| Pin Pitch (mm) | 1.27 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 64Mbit |
| Maximum Access Time | 60ns |
| Chip Density | 4Mbit |
| Subcategory | EDO |
| Data Bus Width | 32bit |
| Number of Chip per Module | 16 |
| Organization | 2Mx32 |
| Chip Package Type | SIP |
| Typical Operating Supply Voltage | 5V |
| Maximum Operating Current | 920mA |
| Min Operating Supply Voltage | 4.75V |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| ECC Support | No |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron HB56U232SB-6C Datasheet
Download the complete datasheet for Micron HB56U232SB-6C to view detailed technical specifications.
No datasheet is available for this part.