2Gbyte DDR3 SDRAM Registered DIMM module, operating at 1333 MHz with a 72-bit data bus width. Features 18 chips, each 1G bit, organized as 256Mx72, with ECC support and single rank. This 240-pin RDIMM, conforming to JEDEC MO-269, operates at 1.5V with a CAS latency of 9. The non-lead-frame SMT package measures 133.5mm (Max) length, 4mm (Max) width, and 30.5mm (Max) height, with a 1mm pin pitch for socket mounting.
PackageRDIMM
MountingSocket
Quick Jump:
Technical Specifications
Micron MT18JSF25672PZ-1G4F1 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | RDIMM |
| Package Description | Registered Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.5(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 30.5(Max) |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Jedec | MO-269 |
| Main Category | DRAM Module |
| Total Density | 2Gbyte |
| Module Type | 240RDIMM |
| Maximum Clock Rate | 1333MHz |
| Chip Density | 1Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 18 |
| Organization | 256Mx72 |
| Typical Operating Supply Voltage | 1.5V |
| Maximum Operating Current | 3960mA |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 256Mx4 |
| ECC Support | Yes |
| Number of Ranks | Single |
| CAS Latency | 9 |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Micron MT18JSF25672PZ-1G4F1 Datasheet
Download the complete datasheet for Micron MT18JSF25672PZ-1G4F1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.