256MB SDRAM module, 168-pin UDIMM, operating at 133 MHz with a 3.3V supply. Features 72-bit data bus width, 18 chips organized as 32Mx72, and 16Mx8 chip configuration. Supports ECC with dual ranks and a CAS latency of 3. Package dimensions are 133.5mm (L) x 3.99mm (W) x 35.05mm (H) with a 1.27mm pin pitch.
PackageUDIMM
MountingSocket
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Technical Specifications
Micron MT18LSDT3272AY-133L1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
UDIMM
Package Description
Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
168
PCB
168
Package Length (mm)
133.5(Max)
Package Width (mm)
3.99(Max)
Package Height (mm)
35.05(Max)
Pin Pitch (mm)
1.27
Mounting
Socket
Jedec
MO-161
Main Category
DRAM Module
Total Density
256Mbyte
Module Type
168UDIMM
Maximum Access Time
6|5.4ns
Maximum Clock Rate
133MHz
Chip Density
128Mbit
Subcategory
SDRAM
Data Bus Width
72bit
Number of Chip per Module
18
Organization
32Mx72
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
1368mA
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
0°C
Max Operating Temperature
65°C
Chip Configuration
16Mx8
ECC Support
Yes
Number of Ranks
Dual
CAS Latency
3
Compliance
Cage Code
6Y440
EU RoHS
Yes with Exemption
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT18LSDT3272AY-133L1 Datasheet
Download the complete datasheet for Micron MT18LSDT3272AY-133L1 to view detailed technical specifications.
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