8GB DDR3 SDRAM LRDIMM module, featuring 1066 MHz clock rate and 72-bit data bus width. This 240-pin Load Reduced Dual In Line Memory Module offers 8Gbyte total density with 36 chips organized as 1Gx72, utilizing 2Gbit chips. Operating at a typical 1.5V supply voltage, it supports ECC and dual ranks, with a CAS latency of 7. The non-lead-frame SMT package measures 133.5mm (Max) length, 7.55mm (Max) width, and 30.5mm (Max) height, with a 1mm pin pitch.
PackageLRDIMM
MountingSocket
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Technical Specifications
Micron MT36JSZF1G72LZ-1G1D1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
LRDIMM
Package Description
Load Reduced Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5(Max)
Package Width (mm)
7.55(Max)
Package Height (mm)
30.5(Max)
Pin Pitch (mm)
1
Mounting
Socket
Jedec
MO-269
Main Category
DRAM Module
Total Density
8Gbyte
Module Type
240LRDIMM
Maximum Clock Rate
1066MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
72bit
Number of Chip per Module
36
Organization
1Gx72
Typical Operating Supply Voltage
1.5V
Maximum Operating Current
2646mA
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Chip Configuration
512Mx4
ECC Support
Yes
Number of Ranks
Dual
CAS Latency
7
Compliance
Cage Code
6Y440
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micron MT36JSZF1G72LZ-1G1D1 Datasheet
Download the complete datasheet for Micron MT36JSZF1G72LZ-1G1D1 to view detailed technical specifications.
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