DDR3 SDRAM 8GB LRDIMM module featuring 1333 MHz clock rate and 72-bit data bus width. This 240-pin module offers 8GB total density with 36 chips organized as 1Gx72, utilizing 512Mx4 chip configuration. Operating at 1.5V, it supports ECC and dual ranks, with a CAS latency of 9. The LRDIMM package measures 133.5mm x 7.55mm x 30.5mm and is designed for socket mounting.
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Micron MT36JSZF1G72LZ-1G4D1 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | LRDIMM |
| Package Description | Load Reduced Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.5(Max) |
| Package Width (mm) | 7.55(Max) |
| Package Height (mm) | 30.5(Max) |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Jedec | MO-269 |
| Main Category | DRAM Module |
| Total Density | 8Gbyte |
| Module Type | 240LRDIMM |
| Maximum Clock Rate | 1333MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 36 |
| Organization | 1Gx72 |
| Typical Operating Supply Voltage | 1.5V |
| Maximum Operating Current | 3006mA |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 95°C |
| Chip Configuration | 512Mx4 |
| ECC Support | Yes |
| Number of Ranks | Dual |
| CAS Latency | 9 |
| Cage Code | 6Y440 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
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