8GB DDR3L SDRAM LRDIMM module, featuring a 240-pin configuration and 1600 MHz clock rate. This memory module offers a 72-bit data bus width and 36 chips per module, organized as 1Gx72. Operating at 1.35/1.5V, it supports ECC and dual ranks, with a CAS latency of 11. The module utilizes a non-lead-frame SMT basic package type, specifically a Load Reduced Dual In Line Memory Module (LRDIMM) with a 240-pin PCB and a pin pitch of 1mm.
PackageLRDIMM
MountingSocket
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Technical Specifications
Micron MT36KSZF1G72LZ-1G6E1A5 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
LRDIMM
Package Description
Load Reduced Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5(Max)
Package Width (mm)
4.67(Max)
Package Height (mm)
30.5(Max)
Pin Pitch (mm)
1
Mounting
Socket
Jedec
MO-269
Main Category
DRAM Module
Total Density
8Gbyte
Module Type
240LRDIMM
Maximum Clock Rate
1600MHz
Chip Density
2Gbit
Subcategory
DDR3L SDRAM
Data Bus Width
72bit
Number of Chip per Module
36
Organization
1Gx72
Typical Operating Supply Voltage
1.35/1.5V
Min Operating Supply Voltage
1.283/1.425V
Max Operating Supply Voltage
1.45/1.575V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Chip Configuration
512Mx4
ECC Support
Yes
Number of Ranks
Dual
CAS Latency
11
Compliance
Cage Code
6Y440
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micron MT36KSZF1G72LZ-1G6E1A5 Datasheet
Download the complete datasheet for Micron MT36KSZF1G72LZ-1G6E1A5 to view detailed technical specifications.
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