8GB DDR3L SDRAM 240-pin RDIMM module, featuring a 72-bit data bus width and Quad rank organization. This module operates at a maximum clock rate of 1066 MHz with a CAS Latency of 7, utilizing 36 chips each with 2Gb density and 256Mx8 configuration. It supports ECC and operates with a typical supply voltage of 1.35/1.5V, within a temperature range of 0°C to 70°C. The Registered Dual In Line Memory Module is housed in a 240-pin DIM package with no lead, designed for socket mounting.
PackageRDIMM
MountingSocket
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Technical Specifications
Micron MT36KSZF1G72PDZ-1G1M1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
RDIMM
Package Description
Registered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5(Max)
Package Width (mm)
7.25(Max)
Package Height (mm)
30.5(Max)
Pin Pitch (mm)
1
Mounting
Socket
Jedec
MO-269
Main Category
DRAM Module
Total Density
8Gbyte
Module Type
240RDIMM
Maximum Clock Rate
1066MHz
Chip Density
2Gbit
Subcategory
DDR3L SDRAM
Data Bus Width
72bit
Number of Chip per Module
36
Organization
1Gx72
Typical Operating Supply Voltage
1.35/1.5V
Maximum Operating Current
1314mA
Min Operating Supply Voltage
1.283/1.425V
Max Operating Supply Voltage
1.45/1.575V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
256Mx8
ECC Support
Yes
Number of Ranks
Quad
CAS Latency
7
Compliance
Cage Code
6Y440
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micron MT36KSZF1G72PDZ-1G1M1 Datasheet
Download the complete datasheet for Micron MT36KSZF1G72PDZ-1G1M1 to view detailed technical specifications.
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