DDR2 SDRAM 512MB 200-pin SODIMM module, operating at 667 MHz with a 64-bit data bus width. Features a 64Mx64 organization, 1G bit chip density, and a 1.8V typical operating supply voltage. This non-lead-frame SMT component utilizes a 200-pin SODIMM package (JEDEC MO-224) with a 0.6mm pin pitch, designed for socket mounting. It offers a maximum operating temperature of 70°C and a CAS latency of 5.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT4HTF6464HZ-667H1 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | SODIMM |
| Package Description | Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 2.45(Max) |
| Package Height (mm) | 30(Max) |
| Pin Pitch (mm) | 0.6 |
| Mounting | Socket |
| Jedec | MO-224 |
| Main Category | DRAM Module |
| Total Density | 512Mbyte |
| Module Type | 200SODIMM |
| Maximum Clock Rate | 667MHz |
| Chip Density | 1Gbit |
| Subcategory | DDR2 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 4 |
| Organization | 64Mx64 |
| Typical Operating Supply Voltage | 1.8V |
| Maximum Operating Current | 540mA |
| Min Operating Supply Voltage | 1.7V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 64Mx16 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 5 |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron MT4HTF6464HZ-667H1 Datasheet
Download the complete datasheet for Micron MT4HTF6464HZ-667H1 to view detailed technical specifications.
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