DDR2 SDRAM 512MB 200-pin SODIMM module, operating at 667 MHz with a 64-bit data bus width. Features a 64Mx64 organization, 1G bit chip density, and a 1.8V typical operating supply voltage. This non-lead-frame SMT component utilizes a 200-pin SODIMM package (JEDEC MO-224) with a 0.6mm pin pitch, designed for socket mounting. It offers a maximum operating temperature of 70°C and a CAS latency of 5.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT4HTF6464HZ-667H1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
200
PCB
200
Package Length (mm)
67.75(Max)
Package Width (mm)
2.45(Max)
Package Height (mm)
30(Max)
Pin Pitch (mm)
0.6
Mounting
Socket
Jedec
MO-224
Main Category
DRAM Module
Total Density
512Mbyte
Module Type
200SODIMM
Maximum Clock Rate
667MHz
Chip Density
1Gbit
Subcategory
DDR2 SDRAM
Data Bus Width
64bit
Number of Chip per Module
4
Organization
64Mx64
Typical Operating Supply Voltage
1.8V
Maximum Operating Current
540mA
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
64Mx16
ECC Support
No
Number of Ranks
Single
CAS Latency
5
Compliance
Cage Code
6Y440
EU RoHS
Yes with Exemption
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT4HTF6464HZ-667H1 Datasheet
Download the complete datasheet for Micron MT4HTF6464HZ-667H1 to view detailed technical specifications.
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