
2Gbyte DDR3L SDRAM 204SODIMM module featuring a 64-bit data bus width and 1066 MHz maximum clock rate. This module utilizes a 256Mx64 organization with 256Mx16 chip configuration, operating at 1.35/1.5V. The SODIMM package, measuring 67.75mm (Max) length, 3.8mm (Max) width, and 30.15mm (Max) height, is designed for socket mounting with a 0.6mm pin pitch. It offers a single rank configuration and a CAS latency of 7, with an operating temperature range of 0°C to 70°C.
Micron MT4KTF25664HZ-1G1E1 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | SODIMM |
| Package Description | Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 204 |
| PCB | 204 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 30.15(Max) |
| Pin Pitch (mm) | 0.6 |
| Mounting | Socket |
| Jedec | MO-268 |
| Main Category | DRAM Module |
| Total Density | 2Gbyte |
| Module Type | 204SODIMM |
| Maximum Clock Rate | 1066MHz |
| Chip Density | 4Gbit |
| Subcategory | DDR3L SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 4 |
| Organization | 256Mx64 |
| Typical Operating Supply Voltage | 1.35/1.5V |
| Maximum Operating Current | 740mA |
| Min Operating Supply Voltage | 1.283/1.425V |
| Max Operating Supply Voltage | 1.45/1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 256Mx16 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 7 |
| Cage Code | 6Y440 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Micron MT4KTF25664HZ-1G1E1 to view detailed technical specifications.
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