2Gbyte DDR3L SDRAM 204SODIMM module featuring a 64-bit data bus width and 1066 MHz maximum clock rate. This module utilizes a 256Mx64 organization with 256Mx16 chip configuration, operating at 1.35/1.5V. The SODIMM package, measuring 67.75mm (Max) length, 3.8mm (Max) width, and 30.15mm (Max) height, is designed for socket mounting with a 0.6mm pin pitch. It offers a single rank configuration and a CAS latency of 7, with an operating temperature range of 0°C to 70°C.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT4KTF25664HZ-1G1E1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
204
PCB
204
Package Length (mm)
67.75(Max)
Package Width (mm)
3.8(Max)
Package Height (mm)
30.15(Max)
Pin Pitch (mm)
0.6
Mounting
Socket
Jedec
MO-268
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
204SODIMM
Maximum Clock Rate
1066MHz
Chip Density
4Gbit
Subcategory
DDR3L SDRAM
Data Bus Width
64bit
Number of Chip per Module
4
Organization
256Mx64
Typical Operating Supply Voltage
1.35/1.5V
Maximum Operating Current
740mA
Min Operating Supply Voltage
1.283/1.425V
Max Operating Supply Voltage
1.45/1.575V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
256Mx16
ECC Support
No
Number of Ranks
Single
CAS Latency
7
Compliance
Cage Code
6Y440
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micron MT4KTF25664HZ-1G1E1 Datasheet
Download the complete datasheet for Micron MT4KTF25664HZ-1G1E1 to view detailed technical specifications.
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