1GB DDR2 SDRAM SODIMM module featuring a 200-pin configuration with a 64-bit data bus width and dual ranks. This memory module operates at a maximum clock rate of 667 MHz with a CAS latency of 5, utilizing 128Mx64 organization and 64Mx16 chip configuration. It supports a typical operating supply voltage of 1.8V, with a range of 1.7V to 1.9V, and is housed in a 67.75mm (Max) length, 3.8mm (Max) width, 30.15mm (Max) height SODIMM package with a 0.6mm pin pitch.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT8HTF12864HDZ-667H1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIMM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
200
PCB
200
Package Length (mm)
67.75(Max)
Package Width (mm)
3.8(Max)
Package Height (mm)
30.15(Max)
Pin Pitch (mm)
0.6
Mounting
Socket
Jedec
MO-224
Main Category
DRAM Module
Total Density
1Gbyte
Module Type
200SODIMM
Maximum Clock Rate
667MHz
Chip Density
1Gbit
Subcategory
DDR2 SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
128Mx64
Typical Operating Supply Voltage
1.8V
Maximum Operating Current
908mA
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
64Mx16
ECC Support
No
Number of Ranks
Dual
CAS Latency
5
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT8HTF12864HDZ-667H1 Datasheet
Download the complete datasheet for Micron MT8HTF12864HDZ-667H1 to view detailed technical specifications.
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