MICRON

MT8VDDT3264HG-262F3

Datasheet

Micron

MT8VDDT3264HG-262F3

Name: MT8VDDT3264HG-262F3 Micron
Brand: Micron
SKU: MT8VDDT3264HG-262F3

DDR2 SDRAM 256MB 200-Pin SODIMM 266MHz

256Mbyte DDR SDRAM SODIMM module featuring a 200-pin interface and 64-bit data bus width. Operates at a maximum clock rate of 266 MHz with a CAS latency of 2. The module utilizes 32Mx8 chip configuration, organized as 32Mx64, and requires a typical operating supply voltage of 2.5V. This general memory module is housed in a Small Outline Dual In Line Memory Module (SODIMM) package, measuring 67.75mm maximum length, 3.8mm maximum width, and 31.9mm maximum height, with a 0.61mm pin pitch.

PackageSODIMM

MountingSocket

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Technical Specifications

Micron MT8VDDT3264HG-262F3 technical specifications.

General

Basic Package Type	Non-Lead-Frame SMT
Package Family Name	DIM
Package/Case	SODIMM
Package Description	Small Outline Dual In Line Memory Module
Lead Shape	No Lead
Pin Count	200
PCB	200
Package Length (mm)	67.75(Max)
Package Width (mm)	3.8(Max)
Package Height (mm)	31.9(Max)
Pin Pitch (mm)	0.61
Mounting	Socket
Jedec	MO-224
Main Category	DRAM Module
Total Density	256Mbyte
Module Type	200SODIMM
Maximum Clock Rate	266MHz
Chip Density	256Mbit
Subcategory	DDR SDRAM
Data Bus Width	64bit
Number of Chip per Module	8
Organization	32Mx64
Typical Operating Supply Voltage	2.5V
Maximum Operating Current	1200mA
Min Operating Supply Voltage	2.3V
Max Operating Supply Voltage	2.7V
Min Operating Temperature	0°C
Max Operating Temperature	70°C
Chip Configuration	32Mx8
ECC Support	No
Number of Ranks	Single
CAS Latency	2

Compliance

Cage Code	6Y440
EU RoHS	No
HTS Code	8473301140
Schedule B	8473300002
ECCN	EAR99
Automotive	No
AEC Qualified	No
PPAP	No
RoHS Versions	2011/65/EU, 2015/863

Datasheet

This datasheet cannot be embedded due to technical restrictions.

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