256Mbyte DDR SDRAM 200SODIMM module, featuring a 64-bit data bus width and 266 MHz maximum clock rate. This module is organized as 32Mx64 with 8 chips per module, each chip configured as 32Mx8. It operates with a typical supply voltage of 2.5V and is housed in a 200-pin SODIMM package (JEDEC MO-224) with a 0.61mm pin pitch. Suitable for socket mounting, it offers a temperature range of 0°C to 70°C.
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Micron MT8VDDT3264HG-265F3 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | SODIMM |
| Package Description | Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 31.9(Max) |
| Pin Pitch (mm) | 0.61 |
| Mounting | Socket |
| Jedec | MO-224 |
| Main Category | DRAM Module |
| Total Density | 256Mbyte |
| Module Type | 200SODIMM |
| Maximum Clock Rate | 266MHz |
| Chip Density | 256Mbit |
| Subcategory | DDR SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 8 |
| Organization | 32Mx64 |
| Typical Operating Supply Voltage | 2.5V |
| Maximum Operating Current | 1200mA |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 32Mx8 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 2.5 |
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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