MICRON

MT8VDDT3264HG-40BF3

Datasheet

Micron

MT8VDDT3264HG-40BF3

Name: MT8VDDT3264HG-40BF3 Micron
Brand: Micron
SKU: MT8VDDT3264HG-40BF3

DDR SDRAM 256MB 200-Pin SODIMM 400MHz

256MB DDR SDRAM SODIMM module featuring a 200-pin configuration and 64-bit data bus width. Operates at a maximum clock rate of 400 MHz with a 2.6V typical supply voltage. Organized as 32Mx64 with 8 chips per module, each chip at 32Mx8 configuration. The module utilizes a non-lead-frame SMT package (DIMM family, SODIMM type) with a 0.61mm pin pitch, measuring 67.75mm max length, 3.8mm max width, and 31.9mm max height. Supports socket mounting and operates within a temperature range of 0°C to 70°C.

PackageSODIMM

MountingSocket

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Technical Specifications

Micron MT8VDDT3264HG-40BF3 technical specifications.

General

Basic Package Type	Non-Lead-Frame SMT
Package Family Name	DIM
Package/Case	SODIMM
Package Description	Small Outline Dual In Line Memory Module
Lead Shape	No Lead
Pin Count	200
PCB	200
Package Length (mm)	67.75(Max)
Package Width (mm)	3.8(Max)
Package Height (mm)	31.9(Max)
Pin Pitch (mm)	0.61
Mounting	Socket
Jedec	MO-224
Main Category	DRAM Module
Total Density	256Mbyte
Module Type	200SODIMM
Maximum Clock Rate	400MHz
Chip Density	256Mbit
Subcategory	DDR SDRAM
Data Bus Width	64bit
Number of Chip per Module	8
Organization	32Mx64
Typical Operating Supply Voltage	2.6V
Maximum Operating Current	1600mA
Min Operating Supply Voltage	2.5V
Max Operating Supply Voltage	2.7V
Min Operating Temperature	0°C
Max Operating Temperature	70°C
Chip Configuration	32Mx8
ECC Support	No
Number of Ranks	Single
CAS Latency	3

Compliance

Cage Code	6Y440
EU RoHS	No
HTS Code	8473301140
Schedule B	8473300002
ECCN	EAR99
Automotive	No
AEC Qualified	No
PPAP	No
RoHS Versions	2011/65/EU, 2015/863

Datasheet

This datasheet cannot be embedded due to technical restrictions.

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