512Mbyte DDR SDRAM DRAM Module, 200-pin SODIMM, operating at 266 MHz with a 64-bit data bus width. Features 8 chips per module, organized as 64Mx64, utilizing 64Mx8 chip configuration. This non-lead-frame SMT component has a 200-pin SODIMM package (JEDEC MO-224) with dimensions of 67.75mm(Max) length, 3.8mm(Max) width, and 31.9mm(Max) height, with a 0.61mm pin pitch. Operates with a typical supply voltage of 2.5V (2.3V-2.7V range) and supports a temperature range of 0°C to 70°C.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT8VDDT6464HG-265F3 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
200
PCB
200
Package Length (mm)
67.75(Max)
Package Width (mm)
3.8(Max)
Package Height (mm)
31.9(Max)
Pin Pitch (mm)
0.61
Mounting
Socket
Jedec
MO-224
Main Category
DRAM Module
Total Density
512Mbyte
Module Type
200SODIMM
Maximum Clock Rate
266MHz
Chip Density
512Mbit
Subcategory
DDR SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
64Mx64
Typical Operating Supply Voltage
2.5V
Maximum Operating Current
1160mA
Min Operating Supply Voltage
2.3V
Max Operating Supply Voltage
2.7V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
64Mx8
ECC Support
No
Number of Ranks
Single
CAS Latency
2.5
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT8VDDT6464HG-265F3 Datasheet
Download the complete datasheet for Micron MT8VDDT6464HG-265F3 to view detailed technical specifications.
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