512Mbyte DDR SDRAM DRAM Module, 200-pin SODIMM, operating at 266 MHz with a 64-bit data bus width. Features 8 chips per module, organized as 64Mx64, utilizing 64Mx8 chip configuration. This non-lead-frame SMT component has a 200-pin SODIMM package (JEDEC MO-224) with dimensions of 67.75mm(Max) length, 3.8mm(Max) width, and 31.9mm(Max) height, with a 0.61mm pin pitch. Operates with a typical supply voltage of 2.5V (2.3V-2.7V range) and supports a temperature range of 0°C to 70°C.
PackageSODIMM
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Technical Specifications
Micron MT8VDDT6464HG-265F3 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | SODIMM |
| Package Description | Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 31.9(Max) |
| Pin Pitch (mm) | 0.61 |
| Mounting | Socket |
| Jedec | MO-224 |
| Main Category | DRAM Module |
| Total Density | 512Mbyte |
| Module Type | 200SODIMM |
| Maximum Clock Rate | 266MHz |
| Chip Density | 512Mbit |
| Subcategory | DDR SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 8 |
| Organization | 64Mx64 |
| Typical Operating Supply Voltage | 2.5V |
| Maximum Operating Current | 1160mA |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 64Mx8 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 2.5 |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron MT8VDDT6464HG-265F3 Datasheet
Download the complete datasheet for Micron MT8VDDT6464HG-265F3 to view detailed technical specifications.
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