DDR SDRAM module offering 512Mbyte total density and 64Mx64 organization. Features a 200-pin SODIMM package with a 0.61mm pin pitch, designed for socket mounting. Operates at a maximum clock rate of 400 MHz with a 64-bit data bus width. Supports a typical operating supply voltage of 2.6V, with a minimum of 2.5V and a maximum of 2.7V. This module operates within a temperature range of 0°C to 70°C.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT8VDDT6464HG-40BF3 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
200
PCB
200
Package Length (mm)
67.75(Max)
Package Width (mm)
3.8(Max)
Package Height (mm)
31.9(Max)
Pin Pitch (mm)
0.61
Mounting
Socket
Jedec
MO-224
Main Category
DRAM Module
Total Density
512Mbyte
Module Type
200SODIMM
Maximum Clock Rate
400MHz
Chip Density
512Mbit
Subcategory
DDR SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
64Mx64
Typical Operating Supply Voltage
2.6V
Maximum Operating Current
1560mA
Min Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.7V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
64Mx8
ECC Support
No
Number of Ranks
Single
CAS Latency
3
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT8VDDT6464HG-40BF3 Datasheet
Download the complete datasheet for Micron MT8VDDT6464HG-40BF3 to view detailed technical specifications.
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