1Gbyte DDR3 SDRAM Registered DIMM module featuring a 240-pin configuration and 1066 MHz maximum clock rate. This module offers a 72-bit data bus width, 128Mx72 organization, and supports ECC with a CAS latency of 7. Operating at a typical 1.5V supply voltage, it utilizes a non-lead-frame SMT package with no lead, measuring 133.5mm in length, 4mm in width, and 30.5mm in height. Designed for socket mounting, it operates within a temperature range of 0°C to 70°C.
PackageRDIMM
MountingSocket
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Technical Specifications
Micron MT9JSF12872PZ-1G1F1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
RDIMM
Package Description
Registered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
30.5(Max)
Pin Pitch (mm)
1
Mounting
Socket
Jedec
MO-269
Main Category
DRAM Module
Total Density
1Gbyte
Module Type
240RDIMM
Maximum Clock Rate
1066MHz
Chip Density
1Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
72bit
Number of Chip per Module
9
Organization
128Mx72
Typical Operating Supply Voltage
1.5V
Maximum Operating Current
1710mA
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
128Mx8
ECC Support
Yes
Number of Ranks
Single
CAS Latency
7
Compliance
Cage Code
6Y440
EU RoHS
Yes with Exemption
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT9JSF12872PZ-1G1F1 Datasheet
Download the complete datasheet for Micron MT9JSF12872PZ-1G1F1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.