4GB DDR3L SDRAM Very Low Profile Unbuffered DIMM module, operating at 1600 MHz with a 72-bit data bus width. Features ECC support, a single rank configuration, and a CAS Latency of 11. This 240-pin module utilizes 512Mx72 organization with 512Mx8 chip configuration, designed for socket mounting and operating within a 1.283/1.425V to 1.45/1.575V supply range. The package is a VLP UDIMM with a maximum height of 18.9mm, meeting JEDEC MO-269 standards.
PackageVLP UDIMM
MountingSocket
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Technical Specifications
Micron MT9KDF51272AZ-1G6E1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIMM
Package/Case
VLP UDIMM
Package Description
Very Low Profile Unbuffered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.5(Max)
Package Width (mm)
2.7(Max)
Package Height (mm)
18.9(Max)
Pin Pitch (mm)
1
Mounting
Socket
Jedec
MO-269
Main Category
DRAM Module
Total Density
4Gbyte
Module Type
240UDIMM
Maximum Clock Rate
1600MHz
Chip Density
4Gbit
Subcategory
DDR3L SDRAM
Data Bus Width
72bit
Number of Chip per Module
9
Organization
512Mx72
Typical Operating Supply Voltage
1.35/1.5V
Maximum Operating Current
1413mA
Min Operating Supply Voltage
1.283/1.425V
Max Operating Supply Voltage
1.45/1.575V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
512Mx8
ECC Support
Yes
Number of Ranks
Single
CAS Latency
11
Compliance
Cage Code
6Y440
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Micron MT9KDF51272AZ-1G6E1 Datasheet
Download the complete datasheet for Micron MT9KDF51272AZ-1G6E1 to view detailed technical specifications.
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