64Gb eMMC MLC memory uses an 8G x8 component configuration in a 153-ball VFBGA package. The device supports the MMC 5.0 protocol with a 200MHz clock rate and 400MT/s transfer rate. I/O voltage is specified at 3.3V, and the package measures 11.50mm by 13.00mm by 1.00mm. Commercial and industrial temperature suffixes exist for this base part number, and the matching Micron catalog entries are obsolete.
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| Capacity | 64Gb |
| Component density | 64Gb |
| Clock speed | 200MHz |
| Transfer rate | 400MT/s |
| I/O voltage | 3.3V |
| Protocol | MMC 5.0 |
| Operating temperature | -25 to +85 for 1M WT; -40 to +85 for 4M IT°C |
| Pin count | 153ball |
| Component configuration | 8G x8 |
| Package dimensions | 11.50 x 13.00 x 1.00mm |
| Number of components | 1 |
| Technology | eMMC MLC |
| Package | VFBGA |
| Product family | MCP |
| Package Environmental Classification | GREEN |
These are design resources that include the Micron MTFC8GAKAJCN
Hardware design guide for NXP i.MX RT500 series MCUs, providing recommendations for power domains, clocking, decoupling, and layout based on the MIMXRT595-EVK.
