PackageTSOP
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Technical Specifications
Micron NAND08GW3F2AN6F technical specifications.
General
| Address Bus Width | 31b |
| Package/Case | TSOP |
| Density | 8Gb |
| Interface | Serial, Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | NAND, |
| Min Operating Temperature | -40°C |
| Packaging | Tape and Reel |
| Page Size | 2KB |
| Radiation Hardening | No |
Compliance
| RoHS | Compliant |
Datasheet
Micron NAND08GW3F2AN6F Datasheet
Download the complete datasheet for Micron NAND08GW3F2AN6F to view detailed technical specifications.
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