PackageP
MountingThrough Hole
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Technical Specifications
Microsemi 30KPA70CE3/TR13 technical specifications.
General
| Package/Case | P |
| Contact Plating | Tin, Matte |
| Diode Type | ZENER |
| Min Breakdown Voltage | 73.71V |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Number of Bidirectional Channels | 1 |
| Packaging | Tape and Reel |
| Peak Pulse Power | 30kW |
| Power Line Protection | No |
| Reverse Standoff Voltage | 70V |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi 30KPA70CE3/TR13 Datasheet
Download the complete datasheet for Microsemi 30KPA70CE3/TR13 to view detailed technical specifications.
No datasheet is available for this part.