Quick Jump:
Technical Specifications
Microsemi A2F060M3E-1CSG288 technical specifications.
General
Package/Case
TFBGA
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Number of I/Os
10
Number of Logic Blocks (LABs)
8
Package Quantity
176
Peripherals
POR, WDT, DMA
RoHS Compliant
Yes
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F060M3E-1CSG288 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-1CSG288 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.