Frequency100MHz
PackageTFBGA
Quick Jump:
Technical Specifications
Microsemi A2F060M3E-1CSG288I technical specifications.
General
| Package/Case | TFBGA |
| Core Architecture | ARM |
| Interface | I2C, SPI, UART, USART, EBI/EMI |
| Max Frequency | 100MHz |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Number of I/Os | 10 |
| Number of Logic Blocks (LABs) | 8 |
| Number of Registers | 1536 |
| Operating Supply Voltage | 1.5V |
| Package Quantity | 176 |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| Radiation Hardening | No |
| RAM Size | 16384b |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
| Speed Grade | 1 |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi A2F060M3E-1CSG288I Datasheet
Download the complete datasheet for Microsemi A2F060M3E-1CSG288I to view detailed technical specifications.
No datasheet is available for this part.