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Technical Specifications
Microsemi A2F060M3E-1FG256 technical specifications.
General
Package/Case
LBGA
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Number of I/Os
10
Number of Logic Blocks (LABs)
8
Number of Registers
1536
Operating Supply Voltage
1.5V
Package Quantity
90
Packaging
Tray
Peripherals
POR, WDT, DMA
Radiation Hardening
No
RAM Size
131072b
RoHS Compliant
No
Series
SmartFusion®
Speed Grade
1
Compliance
RoHS
Not CompliantNo
Datasheet
Microsemi A2F060M3E-1FG256 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-1FG256 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.