Quick Jump:
Technical Specifications
Microsemi A2F060M3E-1FGG256 technical specifications.
General
Package/Case
LBGA
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Number of I/Os
10
Number of Logic Blocks (LABs)
8
Operating Supply Voltage
1.5V
Package Quantity
90
Peripherals
POR, WDT, DMA
RAM Size
16384b
RoHS Compliant
Yes
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F060M3E-1FGG256 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-1FGG256 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.