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Microsemi A2F060M3E-TQG144 technical specifications.
| Package/Case | LQFP |
| Core Architecture | ARM |
| Interface | I2C, SPI, UART, USART, EBI/EMI |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| RAM Size | 16KB |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
| RoHS | Compliant |
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