Quick Jump:
Technical Specifications
Microsemi A2F060M3E-TQG144I technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | ARM |
| Interface | I2C, SPI, UART, USART, EBI/EMI |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| RAM Size | 16KB |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi A2F060M3E-TQG144I Datasheet
Download the complete datasheet for Microsemi A2F060M3E-TQG144I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
