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Technical Specifications
Microsemi A2F060M3E-TQG144I technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Packaging
Tray
Peripherals
POR, WDT, DMA
RAM Size
16KB
RoHS Compliant
Yes
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F060M3E-TQG144I Datasheet
Download the complete datasheet for Microsemi A2F060M3E-TQG144I to view detailed technical specifications.
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