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Technical Specifications
Microsemi A2F500M3G-FGG484I technical specifications.
General
Package/Case
BGA
Core Architecture
ARM
Data Rate
400Kbps
Interface
I2C, SPI, Ethernet, UART, USART, EBI/EMI
Lead Free
Lead Free
Max Frequency
100MHz
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.575V
Memory Size
110592b
Min Supply Voltage
1.425V
Number of Gates
500000
Number of I/Os
204
Number of Logic Elements/Cells
5500
Operating Supply Current
16.5mA
Operating Supply Voltage
1.5V
Package Quantity
60
Peripherals
POR, WDT, DMA
RoHS Compliant
Yes
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F500M3G-FGG484I Datasheet
Download the complete datasheet for Microsemi A2F500M3G-FGG484I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.