Microsemi
A2F500M3G-FGG484M
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484-Pin FBGA
PackageBGA
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Technical Specifications
Microsemi A2F500M3G-FGG484M technical specifications.
General
Package/Case
BGA
Core Architecture
ARM
Interface
I2C, SPI, Ethernet, UART, USART, EBI/EMI
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Package Quantity
60
Packaging
Tray
Peripherals
POR, WDT, DMA
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F500M3G-FGG484M Datasheet
Download the complete datasheet for Microsemi A2F500M3G-FGG484M to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.