Quick Jump:
Technical Specifications
Microsemi A2F500M3G-FGG484M technical specifications.
General
| Package/Case | BGA |
| Core Architecture | ARM |
| Interface | I2C, SPI, Ethernet, UART, USART, EBI/EMI |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Package Quantity | 60 |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| Series | SmartFusion® |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi A2F500M3G-FGG484M Datasheet
Download the complete datasheet for Microsemi A2F500M3G-FGG484M to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.