The ProASIC3 FPGA from Microsemi is a high-density, low-power device with 1 million gates and 97 I/Os. It operates within a supply voltage range of 1.14 to 1.26V and has a maximum operating temperature of 70°C. The device is packaged in a 13mm x 13mm FBGA package and is available in a tray packaging format. The ProASIC3 is not radiation hardened and has a RAM size of 147,456 bits. It is compliant with RoHS regulations.
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Microsemi A3P1000L-FGG144 technical specifications.
| Package/Case | FBGA |
| Height | 1.05mm |
| Length | 13mm |
| Max Frequency | 781.25MHz |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Max Supply Voltage | 1.26V |
| Min Supply Voltage | 1.14V |
| Number of Gates | 1000000 |
| Number of I/Os | 97 |
| Number of Registers | 24576 |
| Operating Supply Voltage | 1.2V |
| Package Quantity | 160 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 147456b |
| RoHS Compliant | Yes |
| Series | ProASIC3 |
| Weight | 0.01411oz |
| Width | 13mm |
| RoHS | Compliant |
Download the complete datasheet for Microsemi A3P1000L-FGG144 to view detailed technical specifications.
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