The A3P250L-1FGG256 is a high-performance field-programmable gate array (FPGA) from Microsemi. This device features 250,000 gates and is packaged in a 1.2mm-high flip-chip ball grid array (FBGA) with dimensions of 17mm in length and width. The FPGA operates reliably over a temperature range of 0°C to 70°C and consumes a supply current of 3 milliamperes at a voltage of 1.2 volts. The device is compliant with the Restriction of Hazardous Substances (RoHS) directive and is available in tray packaging, with 90 units per package. The A3P250L-1FGG256 also features 157 input/output (I/O) connections, 6,144 registers, and 36,864 bytes of random-access memory (RAM).
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| Package/Case | FBGA |
| Height | 1.2mm |
| Length | 17mm |
| Max Frequency | 892.86MHz |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Max Supply Voltage | 1.26V |
| Min Supply Voltage | 1.14V |
| Mount | Surface Mount |
| Number of Gates | 250000 |
| Number of I/Os | 157 |
| Number of Registers | 6144 |
| Operating Supply Current | 3mA |
| Operating Supply Voltage | 1.2V |
| Package Quantity | 90 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 36864b |
| RoHS Compliant | Yes |
| Series | ProASIC3L |
| Speed Grade | 1 |
| Weight | 0.01411oz |
| Width | 17mm |
| RoHS | Compliant |
Download the complete datasheet for Microsemi A3P250L-1FGG256 to view detailed technical specifications.
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