The AFS600-1FGG256K is a high-density FPGA from Microsemi with 600,000 gates and 110,592 bits of RAM. It operates over a temperature range of -55°C to 100°C and is designed for surface mount applications in a LBGA package. The device is compliant with RoHS regulations and is available in a tray packaging format.
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| Package/Case | LBGA |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Gates | 600000 |
| Number of I/Os | 119 |
| Packaging | Tray |
| RAM Size | 110592b |
| RoHS Compliant | Yes |
| Series | Fusion® |
| RoHS | Compliant |
Download the complete datasheet for Microsemi AFS600-1FGG256K to view detailed technical specifications.
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