The AFS600-FGG256K is a high-density FPGA from Microsemi, featuring 600,000 gates and 119 I/Os. It operates over a temperature range of -55°C to 100°C and is designed for surface mount applications in the LBGA package. The device is RoHS compliant and part of the Fusion series.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Microsemi AFS600-FGG256K technical specifications.
General
| Package/Case | LBGA |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Gates | 600000 |
| Number of I/Os | 119 |
| Package Quantity | 90 |
| RAM Size | 110592b |
| RoHS Compliant | Yes |
| Series | Fusion® |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi AFS600-FGG256K Datasheet
Download the complete datasheet for Microsemi AFS600-FGG256K to view detailed technical specifications.
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