The AFS600-FGG484I is a high-speed field-programmable gate array from Microsemi, packaged in a 484-ball flip-chip ball grid array (FBGA). It operates over a temperature range of -40°C to 85°C and is powered by a 1.425V to 1.575V supply voltage. The device features 600,000 gates, 172 I/Os, and 13,824 registers, with a maximum frequency of 1.0989GHz. It is available in a tray packaging configuration with 60 units per package. The AFS600-FGG484I is compliant with RoHS regulations and is not radiation hardened.
Frequency1.0989GHz
PackageFBGA
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Technical Specifications
Microsemi AFS600-FGG484I technical specifications.
General
| Package/Case | FBGA |
| Height | 1.73mm |
| Lead Free | Lead Free |
| Length | 23mm |
| Max Frequency | 1.0989GHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 1.575V |
| Min Supply Voltage | 1.425V |
| Number of Gates | 600000 |
| Number of I/Os | 172 |
| Number of Registers | 13824 |
| Operating Supply Voltage | 1.5V |
| Package Quantity | 60 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 110592b |
| RoHS Compliant | Yes |
| Series | Fusion |
| Weight | 0.01411oz |
| Width | 23mm |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi AFS600-FGG484I Datasheet
Download the complete datasheet for Microsemi AFS600-FGG484I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.