PackageSOIC
MountingSurface Mount
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Technical Specifications
Microsemi LE89810BSC technical specifications.
General
| Package/Case | SOIC |
| Max Power Dissipation | 120mW |
| Mount | Surface Mount |
| Number of Channels | 2 |
| Package Quantity | 2250 |
| Packaging | Tray |
| RoHS Compliant | No |
| Weight | 0.023492oz |
Compliance
| RoHS | Not Compliant |
Datasheet
Microsemi LE89810BSC Datasheet
Download the complete datasheet for Microsemi LE89810BSC to view detailed technical specifications.
No datasheet is available for this part.