PackageSOIC
MountingSurface Mount
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Technical Specifications
Microsemi SG2526BDW-TR technical specifications.
General
| Package/Case | SOIC |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -25°C |
| Mount | Surface Mount |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Topology | Push-Pull |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi SG2526BDW-TR Datasheet
Download the complete datasheet for Microsemi SG2526BDW-TR to view detailed technical specifications.
No datasheet is available for this part.