PackageCDIP
MountingThrough Hole
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Technical Specifications
Microsemi SG3846J technical specifications.
General
| Package/Case | CDIP |
| Fall Time | 50ns |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Mount | Through Hole |
| Output Current | 100mA |
| Packaging | Bulk |
| Radiation Hardening | Yes |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantYes |
Datasheet
Microsemi SG3846J Datasheet
Download the complete datasheet for Microsemi SG3846J to view detailed technical specifications.
No datasheet is available for this part.