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Technical Specifications
Micross AS8FLC1M32BP-100/Q technical specifications.
General
| Package/Case | HIP |
| Pin Count | 66 |
| PCB | 66 |
| Package Length (mm) | 30.48(Max) |
| Package Width (mm) | 30.48(Max) |
| Package Height (mm) | 5.33(Max) |
| Seated Plane Height (mm) | 6.22(Max) |
| Mounting | Through Hole |
| Main Category | Flash Module |
| Total Density | 32Mbit |
| Maximum Access Time | 100ns |
| Chip Density | 8Mbit |
| Subcategory | Parallel |
| Data Bus Width | 32bit |
| Number of Chip per Module | 4 |
| Organization | 1Mx32 |
| Chip Package Type | HIP |
| Typical Operating Supply Voltage | 3.3V |
| Maximum Operating Current | 140mA |
| Chip Configuration | 1Mx8 |
| ECC Support | No |
Compliance
| Cage Code | 0LRZ0 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micross AS8FLC1M32BP-100/Q Datasheet
Download the complete datasheet for Micross AS8FLC1M32BP-100/Q to view detailed technical specifications.
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