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Technical Specifications
Micross AS8FLC1M32BP-70/Q technical specifications.
General
Package/Case
HIP
Pin Count
66
PCB
66
Package Length (mm)
30.48(Max)
Package Width (mm)
30.48(Max)
Package Height (mm)
5.33(Max)
Seated Plane Height (mm)
6.22(Max)
Mounting
Through Hole
Main Category
Flash Module
Total Density
32Mbit
Maximum Access Time
70ns
Chip Density
8Mbit
Subcategory
Parallel
Data Bus Width
32bit
Number of Chip per Module
4
Organization
1Mx32
Chip Package Type
HIP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
140mA
Chip Configuration
1Mx8
ECC Support
No
Compliance
Cage Code
0LRZ0
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micross AS8FLC1M32BP-70/Q Datasheet
Download the complete datasheet for Micross AS8FLC1M32BP-70/Q to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.