32Mbit parallel Flash Module, featuring a 1Mx32 organization and 32-bit data bus width. This module utilizes four 8Mbit chips, each with a 1Mx8 configuration, and offers a maximum access time of 70 ns. The component is housed in a 68-pin Ceramic Quad Flat Package (CQFP) for surface mounting, with a maximum package dimension of 22.61mm x 22.61mm x 3.18mm. Operating at a typical 3.3V supply, it functions within a temperature range of -40°C to 85°C.
PackageCQFP
MountingSurface Mount
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Technical Specifications
Micross AS8FLC1M32BQ-70/IT technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | CQFP |
| Package Description | Ceramic Quad Flat Package |
| Pin Count | 68 |
| PCB | 68 |
| Package Length (mm) | 22.61(Max) |
| Package Width (mm) | 22.61(Max) |
| Package Height (mm) | 3.18(Max) |
| Seated Plane Height (mm) | 3.56(Max) |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Main Category | Flash Module |
| Total Density | 32Mbit |
| Maximum Access Time | 70ns |
| Chip Density | 8Mbit |
| Subcategory | Parallel |
| Data Bus Width | 32bit |
| Number of Chip per Module | 4 |
| Organization | 1Mx32 |
| Chip Package Type | CQFP |
| Typical Operating Supply Voltage | 3.3V |
| Maximum Operating Current | 140mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 1Mx8 |
| ECC Support | No |
Compliance
| Cage Code | 0LRZ0 |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | 4A994.a |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micross AS8FLC1M32BQ-70/IT Datasheet
Download the complete datasheet for Micross AS8FLC1M32BQ-70/IT to view detailed technical specifications.
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