32Mbit parallel Flash Module, featuring a 1Mx32 organization and 32-bit data bus width. This module utilizes four 8Mbit chips, each with a 1Mx8 configuration, and offers a maximum access time of 70 ns. The component is housed in a 68-pin Ceramic Quad Flat Package (CQFP) for surface mounting, with a maximum package dimension of 22.61mm x 22.61mm x 3.18mm. Operating at a typical 3.3V supply, it functions within a temperature range of -40°C to 85°C.
PackageCQFP
MountingSurface Mount
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Technical Specifications
Micross AS8FLC1M32BQ-70/IT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
CQFP
Package Description
Ceramic Quad Flat Package
Pin Count
68
PCB
68
Package Length (mm)
22.61(Max)
Package Width (mm)
22.61(Max)
Package Height (mm)
3.18(Max)
Seated Plane Height (mm)
3.56(Max)
Package Material
Ceramic
Mounting
Surface Mount
Main Category
Flash Module
Total Density
32Mbit
Maximum Access Time
70ns
Chip Density
8Mbit
Subcategory
Parallel
Data Bus Width
32bit
Number of Chip per Module
4
Organization
1Mx32
Chip Package Type
CQFP
Typical Operating Supply Voltage
3.3V
Maximum Operating Current
140mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Chip Configuration
1Mx8
ECC Support
No
Compliance
Cage Code
0LRZ0
HTS Code
8473301140
Schedule B
8473300002
ECCN
4A994.a
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micross AS8FLC1M32BQ-70/IT Datasheet
Download the complete datasheet for Micross AS8FLC1M32BQ-70/IT to view detailed technical specifications.
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