The 5013311407 is a Pico-Clasp wire-to-board PCB header featuring a 1.00mm pitch and a single-row vertical orientation. It is an 8-position shrouded header designed for surface mount (SMT) applications. The component features tin plating on the contacts and is manufactured using nylon resin. It is designed for compact electronic applications requiring reliable low-profile connections.
Molex 501331-1407 technical specifications.
| Circuits (Loaded) | 14pcs |
| Pitch - Mating Interface | 1.00mm |
| Current - Maximum per Contact | 1.0A |
| Voltage - Maximum | 125V |
| Operating Temperature Range | -40 to +105°C |
| Durability (mating cycles max) | 30cycles |
| Solder Process Data | Reflow capable (SMT only) |
| RoHS | Compliant |
| Reach Svhc | Not Contained Per -D(2023)8585-DC (23 Jan 2024) |
| Low-halogen | Not Low-Halogen |
Download the complete datasheet for Molex 501331-1407 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.