The NXP 74LVC1G3157GV-G is a single SPDT logic IC with a propagation delay of 1ns and a maximum power dissipation of 250mW. It operates over a temperature range of -40°C to 125°C and is available in a surface mount TSOP package. The device is lead free and suitable for use in a variety of applications.
PackageTSOP
MountingSurface Mount
Power250mW
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Technical Specifications
NXP 74LVC1G3157GV-G technical specifications.
General
| Package/Case | TSOP |
| Lead Free | Lead Free |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 250mW |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 1.65V |
| Mount | Surface Mount |
| Number of Channels | 1 |
| Number of Inputs | 2 |
| Number of Outputs | 1 |
| Operating Supply Current | 40uA |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 250mW |
| Propagation Delay | 1ns |
| Radiation Hardening | No |
| Throw Configuration | SPDT |
Compliance
| RoHS | Compliant |
Datasheet
NXP 74LVC1G3157GV-G Datasheet
Download the complete datasheet for NXP 74LVC1G3157GV-G to view detailed technical specifications.
No datasheet is available for this part.
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