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Technical Specifications
NXP BA277335 technical specifications.
General
Contact Plating
Tin, Matte
Forward Current
100mA
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
715mW
Max Reverse Leakage Current
50nA
Mount
Surface Mount
Package Quantity
20000
Packaging
Tape and Reel
Power Dissipation
715mW
Reverse Voltage
35V
Type
Switch
Compliance
RoHS
Compliant
Datasheet
NXP BA277335 Datasheet
Download the complete datasheet for NXP BA277335 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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