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Technical Specifications
NXP BA792,115 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SOD
Package/Case
SOD
Package Description
Very Small Ceramic Rectangular Surface Mounted Package
Lead Shape
No Lead
Pin Count
2
PCB
2
Package Width (mm)
1.4(Max)
Seated Plane Height (mm)
1.6(Max)
Package Material
Ceramic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP BA792,115 Datasheet
Download the complete datasheet for NXP BA792,115 to view detailed technical specifications.
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