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Technical Specifications
NXP BA891,115 technical specifications.
General
Contact Plating
Tin
Diode Capacitance-Max
1.05pF
Forward Current
100mA
Lead Free
Lead Free
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
715mW
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
715mW
Radiation Hardening
No
Reverse Voltage
35V
Reverse Voltage (DC)
35V
RoHS Compliant
Yes
Type
Switch
Compliance
RoHS
Compliant
Datasheet
NXP BA891,115 Datasheet
Download the complete datasheet for NXP BA891,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.