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Technical Specifications
NXP BAP1321-02,115 technical specifications.
General
Contact Plating
Tin
Diode Type
PIN - Single
Forward Current
100mA
Max Current Rating
100mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
715mW
Mount
Surface Mount
Package Quantity
1
Packaging
Tape and Reel
Power Dissipation
715mW
Radiation Hardening
No
Reach SVHC Compliant
No
Reverse Voltage
60V
Reverse Voltage (DC)
60V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BAP1321-02,115 Datasheet
Download the complete datasheet for NXP BAP1321-02,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.