MountingSurface Mount
Power500mW
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Technical Specifications
NXP BAP50-03 technical specifications.
General
Forward Current
50mA
Height
1.05mm
Length
1.8mm
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
500mW
Max Repetitive Reverse Voltage (Vrrm)
50V
Max Reverse Voltage (DC)
50V
Mount
Surface Mount
Packaging
Cut Tape
Power Dissipation
500mW
Radiation Hardening
No
Reach SVHC Compliant
No
Reverse Voltage
50V
RoHS Compliant
Yes
Termination
SMD/SMT
Width
1.35mm
Compliance
RoHS
Compliant
Datasheet
NXP BAP50-03 Datasheet
Download the complete datasheet for NXP BAP50-03 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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