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Technical Specifications
NXP BAP50-03,135 technical specifications.
General
Package/Case
SOD-323-2
Contact Plating
Tin, Matte
Diode Capacitance-Max
0.4pF
Diode Type
PIN - Single
Forward Current
50mA
Lead Free
Lead Free
Max Current Rating
50mA
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
500mW
Mount
Surface Mount
Package Quantity
10000
Packaging
Tape and Reel
Power Dissipation
500mW
Radiation Hardening
No
Reverse Voltage
50V
Reverse Voltage (DC)
50V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
NXP BAP50-03,135 Datasheet
Download the complete datasheet for NXP BAP50-03,135 to view detailed technical specifications.
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